Application
It can be applied to the third generation semico✔¶nductor high-power devices, high-power lasers an↓€≤d microelectronic thermal sin k devices.
|
Rough Dimension |
≤20*20*10mm |
|
Color |
Above I |
|
Clarity |
Above VS2 |
|
Weight |
（Rough size）≤20.0ct；（Rough Loose Diamond siγφ♣ze）≤10.0ct |
|
Remarks |
It can be cut into 1 ×₩piece big diamond wiγ♠th≤3 ct and 4 pieces small diamonds with 0.3π↑£ct each |
Return
