Application

Used for Brazing, Powder Meta≥™¥llurgy, Cutting Tool, Wire Sa★‌≥$w, Sand Saw, etc.

Material Properties

① By application of A←→≈₹erospace Material and Nanometer Modific∞≠ation Technology

② Binding Degree of Diamond and Metal ≥400MPδ∞♠

③ Adhesion Degree can be imp"↑∏roved 0.5-1 times, compared with traditional>÷©

④ Brazing Diamond in Air

⑤ Manufacturing diamond high heat¶λλ conduction material