Ningbo Crysdiam Technology CO., LTD.
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Diamond Heat Conduction Plate

Application

It can be applied to theφ÷₩÷ third generation semiconductor high-power devi↔®‌¶ces, high-power lasers and microelectronic t‌♦hermal sink devices.

  • Product Overview
  • Thermal Conductivity
    Polycrystalline Diamond
    800~1500W/(m·K)
    Single Crystalline Diamond
    1500~2300W/(m·K)
    Thermal Expansion
    10-6·K-1